Professional Technology

Vertical Grinding Machine

Feature Description :

  • Intelligent human-machine interface control, easy to operate.
  • The vertical structure design enhances machining stability.
  • Fast feed can effectively shorten processing time.
  • The customized design allows for single or multi-piece processing.

Application range:

  • Electronics : semiconductor germanium wafers, package substrates, ceramic substrates.
  • Optical class : Sic, wafer back thinning, window crystal, LED sapphire substrate.