Professional Technology

Double-Sided Precision Lapping and Polishing Machine

Feature Description :

  • Simultaneous double-side lapping for flat workpieces.
  • The arch type pressurizing mechanism is designed to be stable in pressure.
  • The outer ring gear can be up and down stepless to do the loading and unloading of the workpiece.
  • High-precision load cell The pressure control mechanism can be controlled the multi-stage pressure setting in the lapping and polishing process.
  • D.T.I thickness control mechanism, which can be controlled the size of the grinding workpiece.

Application range:

  • Electronics: Semiconductor germanium wafers.
  • Optical: optical glass, SAPPHIRE, window crystal, filter, glass wafer.
  • Machinery: ceramic parts, clutch plates, brake pads.
4-LB 6-LB 9-LB 12-LB
  • D.T.I thickness auto control.
  • Touch Panel Controller.
  • Load Cell Pressure Control.