Professional Technology
Vertical Grinding Machine
Feature Description :
- Intelligent human-machine interface control, easy to operate.
- The vertical structure design enhances machining stability.
- Fast feed can effectively shorten processing time.
- The customized design allows for single or multi-piece processing.
Application range：
- Electronics : semiconductor germanium wafers, package substrates, ceramic substrates.
- Optical class : Sic, wafer back thinning, window crystal, LED sapphire substrate.
Table
Rotary table diameter：Ø400mm
Table speed：100 rpm/min
Table bearing system：ANGULAR BALL BEARING
Table drive motor：1.5kw
Wheel spindle
Bearing type：ANGULAR BALL BEARING
Wheel speed：3000 rpm/min
Wheel diameter：Ø300mm
Wheel drive motor：8.5kw
Wheel feed
Wheel maximum stroke：300mm
Wheel rapid feed rate：1800mm/min
Wheel feed minimum set unit：0.1µm/sec
feed motor：400w
Machine Weight
1500kgs
Machine Dimensions
1004mm x 1180mm x 2008mm
Attached device
Vacuum pump unit：2.2kw
Dressing system：Wheel dressing plate
Centrifuge：0.37kw
Tank Quantity：100L
Pump capacity：50L/min